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 FDP18N20F / FDPF18N20FT N-Channel MOSFET
September 2009
FDP18N20F / FDPF18N20FT
N-Channel MOSFET
200V, 18A, 0.14 Features
* RDS(on) = 0.12 ( Typ.)@ VGS = 10V, ID = 9A * Low gate charge ( Typ. 20nC) * Low Crss ( Typ. 24pF) * Fast switching * 100% avalanche tested * Improve dv/dt capability * RoHS compliant
UniFETTM
tm
Description
These N-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, planar stripe, DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficient switching mode power supplies and active power factor correction.
D
G GDS
TO-220 FDP Series
GD S
TO-220F FDPF Series
S
MOSFET Maximum Ratings TC = 25oC unless otherwise noted
Symbol VDSS VGSS ID IDM EAS IAR EAR dv/dt PD TJ, TSTG TL Parameter Drain to Source Voltage Gate to Source Voltage Drain Current Drain Current Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Power Dissipation (TC = 25oC) - Derate above 25oC -Continuous (TC = 25oC) -Continuous (TC = 100oC) - Pulsed (Note 1) (Note 2) (Note 1) (Note 1) (Note 3) 100 0.83 -55 to +150 300 18 10.8 72 324 18 10 4.5 41 0.33 FDP18N20F FDPF18N20FT 200 30 18* 10.8* 72* Units V V A A mJ A mJ V/ns W W/oC
oC oC
Operating and Storage Temperature Range Maximum Lead Temperature for Soldering Purpose, 1/8" from Case for 5 Seconds
*Drain current limited by maximum junction temperature
Thermal Characteristics
Symbol RJC RCS RJA Parameter Thermal Resistance, Junction to Case Thermal Resistance, Case to Sink Typ. Thermal Resistance, Junction to Ambient FDP18N20F FDPF18N20FT 1.2 0.5 62.5 3.0 62.5
oC/W
Units
(c)2009 Fairchild Semiconductor Corporation FDP18N20F / FDPF18N20FT Rev. A
1
www.fairchildsemi.com
FDP18N20F / FDPF18N20FT N-Channel MOSFET
Package Marking and Ordering Information TC = 25oC unless otherwise noted
Device Marking FDP18N20F FDPF18N20FT Device FDP18N20F FDPF18N20FT Package TO-220 TO-220F Reel Size Tape Width Quantity 50 50
Electrical Characteristics
Symbol Parameter Test Conditions Min. Typ. Max. Units
Off Characteristics
BVDSS BVDSS / TJ IDSS IGSS Drain to Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate to Body Leakage Current ID = 250A, VGS = 0V, TJ = 25oC ID = 250A, Referenced to 25oC VDS = 200V, VGS = 0V VDS = 160V, TC = 125oC VGS = 30V, VDS = 0V 200 0.2 10 100 100 V V/oC A nA
On Characteristics
VGS(th) RDS(on) gFS Gate Threshold Voltage Static Drain to Source On Resistance Forward Transconductance VGS = VDS, ID = 250A VGS = 10V, ID = 9A VDS = 20V, ID = 9A
(Note 4)
3.0 -
0.12 13.6
5.0 0.14 -
V S
Dynamic Characteristics
Ciss Coss Crss Qg(tot) Qgs Qgd Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge at 10V Gate to Source Gate Charge Gate to Drain "Miller" Charge VDS = 160V, ID = 18A VGS = 10V
(Note 4, 5)
VDS = 25V, VGS = 0V f = 1MHz
-
885 200 24 20 5 9
1180 270 35 26 -
pF pF pF nC nC nC
Switching Characteristics
td(on) tr td(off) tf Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time VDD = 100V, ID = 18A RG = 25
(Note 4, 5)
-
16 50 50 40
40 110 110 90
ns ns ns ns
Drain-Source Diode Characteristics
IS ISM VSD trr Qrr Maximum Continuous Drain to Source Diode Forward Current Maximum Pulsed Drain to Source Diode Forward Current Drain to Source Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge VGS = 0V, ISD = 18A VGS = 0V, ISD = 18A dIF/dt = 100A/s
(Note 4)
-
80 240
18 72 1.5 -
A A V ns nC
Notes: 1. Repetitive Rating: Pulse width limited by maximum junction temperature 2. L = 2mH, IAS = 18A, VDD = 50V, RG = 25, Starting TJ = 25C 3. ISD 18A, di/dt 200A/s, VDD BVDSS, Starting TJ = 25C 4. Pulse Test: Pulse width 300s, Duty Cycle 2% 5. Essentially Independent of Operating Temperature Typical Characteristics
FDP18N20F / FDPF18N20FT Rev. A
2
www.fairchildsemi.com
FDP18N20F / FDPF18N20FT N-Channel MOSFET
Typical Performance Characteristics
Figure 1. On-Region Characteristics
50
VGS = 10.0V 8.0 V 7.0 V 6.5 V 6.0 V 5.5 V
Figure 2. Transfer Characteristics
30
ID,Drain Current[A]
ID,Drain Current[A]
10
10
150 C 25 C
o
o
1
*Notes: 1. 250s Pulse Test 2. TC = 25 C
o
*Notes: 1. VDS = 20V 2. 250s Pulse Test
1 0.1 1 VDS,Drain-Source Voltage[V] 10 4 5 6 VGS,Gate-Source Voltage[V] 7
Figure 3. On-Resistance Variation vs. Drain Current and Gate Voltage
0.25
Figure 4. Body Diode Forward Voltage Variation vs. Source Current and Temperature
100
RDS(ON) [], Drain-Source On-Resistance
IS, Reverse Drain Current [A]
150 C
o
o
0.20
VGS = 10V
25 C
10
0.15
VGS = 20V
*Note: TJ = 25 C
o
*Notes: 1. VGS = 0V
2. 250s Pulse Test
0.10 0 10 20 30 ID, Drain Current [A] 40 50
1 0.0
0.4 0.8 1.2 1.6 VSD, Body Diode Forward Voltage [V]
2.0
Figure 5. Capacitance Characteristics
2000
Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd Crss = Cgd
Figure 6. Gate Charge Characteristics
10
VGS, Gate-Source Voltage [V]
VDS = 40V VDS = 100V VDS = 160V
8
1500 Capacitances [pF]
*Note: 1. VGS = 0V 2. f = 1MHz Ciss
6
1000
4
Coss
500
Crss
2
*Note: ID = 18A
0 0.1
0
1 10 VDS, Drain-Source Voltage [V] 30
0
6 12 18 Qg, Total Gate Charge [nC]
24
FDP18N20F / FDPF18N20FT Rev. A
3
www.fairchildsemi.com
FDP18N20F / FDPF18N20FT N-Channel MOSFET
Typical Performance Characteristics (Continued)
Figure 7. Breakdown Voltage Variation vs. Temperature
1.2 BVDSS, [Normalized] Drain-Source Breakdown Voltage
Figure 8-1. Maximum Safe Operating Area - FDP18N20F
100
20s 100s
ID, Drain Current [A]
1.1
10
1ms
1.0
1
Operation in This Area is Limited by R DS(on)
10ms DC
*Notes:
0.9
0.1
*Notes: 1. VGS = 0V 2. ID = 250A
1. TC = 25 C 2. TJ = 150 C 3. Single Pulse
o
o
0.8 -100
0.01
-50 0 50 100 o 150 TJ, Junction Temperature [ C]
200
1
10 100 VDS, Drain-Source Voltage [V]
600
Figure 8-2. Maximum Safe Operating Area - FDPF18N20FT
100
10s 100s
Figure 9. Maximum Drain Current vs. Case Temperature
20
ID, Drain Current [A]
10
ID, Drain Current [A]
1ms
16
1
Operation in This Area is Limited by R DS(on)
10ms
12
8
*Notes:
DC
o o
0.1
1. TC = 25 C 2. TJ = 150 C 3. Single Pulse
4
0.01 1 10 100 VDS, Drain-Source Voltage [V]
600
0 25
50 75 100 125 o TC, Case Temperature [ C]
150
Figure 10-1. Transient Thermal Response Curve - FDP18N20F
2 1 Thermal Response [ZJC]
0.5 0.2
0.1
0.1
PDM
0.05 0.02 0.01
t1
*Notes:
t2
o
0.01
Single pulse
1. ZJC(t) = 1.2 C/W Max. 2. Duty Factor, D= t1/t2 3. TJM - TC = PDM * ZJC(t)
10
-5
10
-4
10 10 10 10 Rectangular Pulse Duration [sec]
-3
-2
-1
0
10
1
10
2
FDP18N20F / FDPF18N20FT Rev. A
4
www.fairchildsemi.com
FDP18N20F / FDPF18N20FT N-Channel MOSFET
Figure 10-2. Transient Thermal Response Curve - FDPF18N20FT
2
0.5
Thermal Response [ZJC]
1
0.2 0.1 0.05
PDM t1 t2
0.1
0.02 0.01
*Notes: 1. ZJC(t) = 3.0 C/W Max. 2. Duty Factor, D= t1/t2 3. TJM - TC = PDM * ZJC(t)
o
0.01
Single pulse
10
-5
10
-4
10 10 10 10 Rectangular Pulse Duration [sec]
-3
-2
-1
0
10
1
10
2
FDP18N20F / FDPF18N20FT Rev. A
5
www.fairchildsemi.com
FDP18N20F / FDPF18N20FT N-Channel MOSFET
Gate Charge Test Circuit & Waveform
Resistive Switching Test Circuit & Waveforms
Unclamped Inductive Switching Test Circuit & Waveforms
FDP18N20F / FDPF18N20FT Rev. A
6
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FDP18N20F / FDPF18N20FT N-Channel MOSFET
Peak Diode Recovery dv/dt Test Circuit & Waveforms
DUT V
+
DS
_ I
SD
L D r iv e r R
G
S am e T ype as DUT
V
DD
V
GS
* d v / d t c o n t r o lle d b y R G * I S D c o n t r o lle d b y p u ls e p e r io d
V GS ( D r iv e r )
G a t e P u ls e W id t h D = -------------------------G a te P u ls e P e r io d
10V
IF M , B o d y D io d e F o r w a r d C u r r e n t
I
SD
(DUT ) IR M
d i/ d t
B o d y D io d e R e v e r s e C u r r e n t
V DS (DUT )
B o d y D io d e R e c o v e r y d v / d t
V
SD
V
DD
B o d y D io d e F o r w a r d V o lt a g e D r o p
FDP18N20F / FDPF18N20FT Rev. A
7
www.fairchildsemi.com
FDP18N20F / FDPF18N20FT N-Channel MOSFET
Mechanical Dimensions
TO-220
FDP18N20F / FDPF18N20FT Rev. A
8
www.fairchildsemi.com
FDP18N20F / FDPF18N20FT N-Channel MOSFET
Package Dimensions
TO-220F Potted
* Front/Back Side Isolation Voltage : 4000V
Dimensions in Millimeters
FDP18N20F / FDPF18N20FT Rev. A
9
www.fairchildsemi.com
FDP18N20F / FDPF18N20FT N-Channel MOSFET
TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. AccuPowerTM PowerTrench(R) FPSTM The Power Franchise(R) PowerXSTM Auto-SPMTM F-PFSTM (R) Programmable Active DroopTM Build it NowTM FRFET(R) Global Power ResourceSM QFET(R) CorePLUSTM TinyBoostTM Green FPSTM QSTM CorePOWERTM TinyBuckTM CROSSVOLTTM Green FPSTM e-SeriesTM Quiet SeriesTM TinyCalcTM CTLTM GmaxTM RapidConfigureTM TinyLogic(R) Current Transfer LogicTM GTOTM TINYOPTOTM EcoSPARK(R) IntelliMAXTM TM TinyPowerTM EfficentMaxTM Saving our world, 1mW /W /kW at a timeTM ISOPLANARTM TinyPWMTM SmartMaxTM EZSWITCHTM* MegaBuckTM TinyWireTM TM* SMART STARTTM MICROCOUPLERTM TriFault DetectTM SPM(R) MicroFETTM TRUECURRENTTM* STEALTHTM MicroPakTM (R) SuperFETTM MillerDriveTM (R) Fairchild SuperSOTTM-3 MotionMaxTM Fairchild Semiconductor(R) UHC(R) SuperSOTTM-6 Motion-SPMTM FACT Quiet SeriesTM Ultra FRFETTM SuperSOTTM-8 OPTOLOGIC(R) (R) FACT OPTOPLANAR(R) UniFETTM SupreMOSTM (R) (R) FAST VCXTM SyncFETTM FastvCoreTM VisualMaxTM Sync-LockTM FETBenchTM XSTM (R)* PDP SPMTM (R)* FlashWriter Power-SPMTM
tm
tm
tm
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
ANTI-COUNTERFEITING POLICY Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.Fairchildsemi.com, under Sales Support. Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handing and storage and provide access to Fairchild's full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative / In Design Definition Datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only.
Rev. I41
Preliminary
First Production
No Identification Needed Obsolete
Full Production Not In Production
10 FDP18N20F / FDPF18N20FT Rev. A
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